Jones Day on Taiwan Semi's $1.5 Billion Bond Issue
The world's largest chipmaker issued two tranches of notes in order to raise money for general corporate purposes.
By Jessica SeahApril 11, 2013
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Jones Day has advised the world’s largest chipmaker, Taiwan Semiconductor Manufacturing Co. Ltd., on its recent $1.5 billion bond offering.
The company issued two tranches of notes—one consisting of three-year notes totaling $350 million and the other five-year notes worth $1.15 billion—through a British Virgin Islands subsidiary. The money will be used for general corporate purposes.
Jones Day Hong Kong partner Julian Lin acted for the company, while
Maples and Calder Hong Kong partner Christine Chang advised on BVI law.
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